Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Multiphysics Process Simulation of the Electromagnetic-Supported Laser Beam Welding

M. Bachmann, V. Avilov, A. Gumenyuk, and M. Rethmeier
BAM Federal Institute for Materials Research and Testing
Berlin, Germany

The article deals with the magnetically-supported high-power full-penetration laser beam welding of aluminum. A stationary simulation was conducted accounting for the effects of natural convection, Marangoni convection and solid-liquid phase transition as well as an electromagnetic volume source term. An ac magnet below the weld specimen induces eddy currents. Consequently, Lorentz forces occur ...

Simulation of Wear using LiveLink™ for MATLAB®

D. Sutton[1]
[1]National Centre for Advanced Tribology at Southampton, University of Southampton, Southampton, United Kingdom

An incremental wear model has been developed using COMSOL Multiphysics® with MATLAB® to predict the evolution of component geometry as a result of wear. Whilst Archard’s wear law is a well-known empirical model for the prediction of wear volume, the design engineer is interested in changes in tolerance as a result of component geometry. At each time step, the simulation extracts the pressure ...

Numerical Study of Laminar Forced Convection Cooling of Circuit Board Mounted Heat Source Array

S. Durgam [1], S. P. Venkateshan [1], T. Sundararajan [1],
[1] Indian Institute of Technology Madras, Chennai, India

This paper deals with the numerical study of optimal distribution of rectangular heat sources populated on a substrate board for electronic cooling. The simulations are performed for laminar forced convection conjugate heat transfer with vertical orientation of substrate board. The laminar forced convection - conjugate heat transfer simulations are carried out using COMSOL Multiphysics® with ...

Understanding the Magnetic Field Penetration in Mesoscopic Superconductors via COMSOL Multiphysics® Software - new

I. G. de Oliveira[1]
[1]Universidade Federal Rural do Rio de Janeiro, Seropédica, RJ, Brazil

Introduction: One of the main characteristic of the superconductors is its diamagnetic response of applied magnetic fields. The superconductors refuse the penetration of magnetic field into its interior, it is the well know Meissner effect, B=0 into the superconductor sample. However when the applied field reach a determined value, the magnetic field can enter. There are two different ways of ...

Finite Element Analysis of Ferrofluid Cooling of Heat Generating Devices

T. Strek
Institute of Applied Mechanics, Poznan University of Technology, Poznan, Poland

An external magnetic field imposed on a ferrofluid with a temperature gradient, results in a non-uniform magnetic body force, which leads to a form of heat transfer called thermomagnetic convection. A magnet placed near the device will always attract the colder ferrofluid more than warmer. Viscous, two-dimensional, laminar and incompressible ferromagnetic fluid flow, under the influence of a ...

Demonstration of All-Optical NAND Logic Gate Using Photonic Integrated Circuits

J. T. Andrews[1], R. Choubey[1], O P Choudhary[1], N. Malviya[1], A. Patel[1], M. Kumar[1], S. Chouksey[1], J. Solanki[1]
[1]National MEMS Design Center, Department of Applied Physics, Shri G S Institute of Technology & Science, Indore 452003 MP, India

A logic gate performs a certain Boolean logic operation on one or more logical inputs and produces a single logical output. The logic values are either “true” or “false.” Logic gates are bistable devices, that is, they may yield one of these two possible stable outputs. The NAND logic is a universal gate; any logic operation can be performed with various combinations of NAND logics. Many ...

Finite Element Analysis of Transient Ballistic-Diffusive Heat Transfer in Two-Dimensional Structures - new

S. Hamian[1], T. Yamada[2], M. Faghri[3], K. Park[1]
[1]University of Utah, Salt Lake City, UT, USA
[2]Lund University, Lund, Sweden
[3]University of Rhode Island, Kingston, RI, USA

For the last two centuries, the conventional Fourier heat conduction equation has been used for modeling a diffusive nature of macroscale heat conduction by considering the energy conservation and Fourier's linear approximation of heat flux. However, it cannot accurately predict heat transport when the length scale is comparable to or smaller than the mean free path of thermal energy carriers or ...

Design of MEMS Based 4-Bit Shift Register

V. B. Math[1], B. G. Sheeparamatti[1], A. C. Katageri[1]
[1]Basaveshwar Engineering College, Bagalkot, Karnataka, India

This paper presents a unique design of MEMS based 4-bit shift register that perform shifting operation same as logic devices that are composed of solid-state transistors. The MEMS shift register design inherits all the advantages from MEMS switches and thus is expected to have more applications. One unique feature of this device is that it can perform all types of shifting mechanisms, but with ...

A Time Dependent Dielectric Breakdown (TDDB) Model for Field Accelerated Low-K Breakdown Due To Copper Ions

R. Achanta, J. Plawsky, and W. Gill
Department of Chemical and Biological Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA

We have simulated the copper ion concentration and internal electric field profiles in a dielectric material by solving the transient continuity/Poisson equations using COMSOL Multiphysics. We have shown that failure of dielectrics can be modeled if we assume that failure in Cu/SiO2/Si devices occurs due to a pile-up of copper ions at the cathode and the subsequent increase in electric field ...

Modelling of a 5 Cell Intermediate Temperature Polymer Electrolyte Fuel Cell (IT-PEFC) Stack: Analysis of Flow Configuration and Heat Transfer

A.S. Chandan[1], A. Mossadegh Pour[2], R. Steinberger-Wilckens[2]
[1]Centre for Hydrogen and Fuel Cell Research, University of Birmingham, Birmingham, United Kingdom
[2]University of Birmingham, Birmingham, United Kingdom

Polymer Electrolyte Fuel Cells (PEFCs) are a key technology in the advancement of society towards a low carbon future, in particular for use within the automotive sector. PEFCs are advantageous due to their low operating temperature (60-80 deg.C), quick start up times and responsiveness to load change. However, the requirement for expensive platinum, difficulty of water management and heat ...