Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Simulations of Micropumps Based on Tilted Flexible Structures - new

M. J. Hancock[1], N. H. Elabbasi[1], M. C. Demirel[2]
[1]Veryst Engineering, LLC., Needham, MA, USA
[2]Pennsylvania State University, University Park, PA, USA

Pumping liquids at small scales is challenging because of the principle of reversibility: in a viscous regime, the flow streamlines through a fixed geometry are the same regardless of flow direction. Recently we developed a class of microfluidic pump designs based on tilted flexible structures that combines the concepts of cilia (flexible elastic elements) and rectifiers (e.g., Tesla pump). We ...

Multiphysics Modelling of a Micro Valve

F. Bircher[1] and P. Marmet[1]

[1]Institute of Print Technology, Bern University of Applied Sciences, Burgdorf, Switzerland

Electromagnetic micro valves are currently developed empirically or the different physics are treated separately. To accelerate the development-process and for a better understanding of the overall system, a multiphysics simulation is built up. This simulation considers the electromagnetics, the electronics (including the control of the process), the mechanics and the fluidics with respect to ...

Design of High Performance Condenser Microphone Using Porous Silicon

S. Suganthi[1], M. Anandraj[2], and L. Sujatha[1]
[1]Department of Electronics & Communication Engineering, Rajalakshmi Engineering College, Chennai, India
[2]Department of Physics, Rajalakshmi Engineering College, Chennai, India

Porous Silicon (PS) can easily be formed by electrochemical etching of silicon in HF based electrolytes at room temperature. Since, PS is compatible with silicon IC technology; it finds lot of applications in the fabrication of MEMS devices. In the current study, we discuss the design of a condenser microphone using a Silicon/ Porous Silicon composite membrane as a movable plate. The performance ...

Robust and Reliability-based Design Optimization of Electromagnetic Actuators Using Heterogeneous Modeling with COMSOL Multiphysics and Dynamic Network Models

H. Neubert[1], A. Kamusella[1], and T-Q. Pham[2]
[1]Technische Universität Dresden, Germany
[2]OptiY e. K. Aschaffenburg, Germany

For an exemplary electromagnetic actuator used to drive a Braille printer, a design optimization was performed. The optimization involves stochastic variables and comprises nominal optimization, robustness analysis and robust design optimization. A heterogeneous model simulates the static and the dynamic behavior of the actuator and its non-linear load. It consists of a network model in ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.

Optimization and Simulation of MEMS Based Thermal Sensor for Performance of Transformer Oil

V. Vijayalakshmi[1], K. C. Devi[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

In this work, a bimetallic strip based thermal sensor was designed using MEMS module of COMSOL Multiphysics® software to monitor the temperature rise in insulating oil which was used as coolant in transformers. The bimetallic strip was designed with different shapes such as cylindrical, rectangle, square & conical and different compositions such as Al/Steel Alloy and Fe/Cu which can withstand ...

Expanding Your Materials Horizons

R. Pryor[1]
[1]Pryor Knowledge Systems, Inc. (COMSOL Certified Consultant), Bloomfield Hills, Michigan, USA

Materials and their related properties are intrinsically fundamental to the creation, development and solution of viable exploratory models when using numerical analysis software. In many cases, simply determining the location, availability and relative accuracy of the necessary material parameters for the physical behavior of even commonly employed design materials can be very difficult and ...

A Methodology For The Simulation Of MEMS Spiral Inductances Used As Magnetic Sensors

S. Druart, D. Flandre, and L.A. Francis
Université catholique de Louvain - ICTEAM, Louvain-la-Neuve, Belgium

In this paper, a methodology to simulate the electric behavior of spiral inductances is presented and discussed. All the methodology is built with the COMSOL software used with the Matlab scripting interface and then allows performing fully parameterized simulations. The program architecture is explained and is used to simulate two applications. The first calculates the voltage induced by an ...

3D Stationary and Temporal Electro-Thermal Simulations of Metal Oxide Gas Sensor Based on a High Temperature and Low Power Consumption Micro-Heater Structure

N. Dufour[1], C. Wartelle[2], P. Menini[1]
[1]LAAS-CNRS, Toulouse, France
[2]Renault, Guyancourt, France

The aim of this work was to simulate the electro-thermal behavior of a micro-hotplate used as a gas sensor, in order to compare the obtained results with a real structure. The structure has been designed in 3D and a stationary and a temporal study has been realized.

FEM-Simulation of a Printed Acceleration Sensor with RF Readout Circuit

H. Schweiger[1], T. Göstenkors[1], R. Bau[1], D. Zielke[1]
[1]Dept. Engineering Sciences and Mathematics, University of Applied Sciences Bielefeld, Bielefeld, Germany

In this paper we want to figure out the development of a capacitive acceleration-sensor system with the FEM-Method. The sensor-system is in the position to detect accelerations in the range of ±20 g. Furthermore the sensor-element contains a printed RF-inductance, which is used for contactless data transfer. On the one hand the simulation of the L-C-oscillating circuit using the RF Module of ...