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Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Design, Fabrication and Simulation of Microchannel Network for MEMS

V. Jain[1], A. K. Sharma[2], P. Kumar[2]
[1]Thapar University, Patiala, Punjab, India
[2]Indian Institute of Technology Roorkee, Roorkee, Uttar Pradesh, India

The greatest challenge being faced for realization of Micro-Electro Mechanical System (MEMS) technology is the lack of a simple, quick and reliable method for the fabrication of 3-D microchannel in the range of micrometers. A novel fabrication technique which opens possibilities for the production of these microfluidic channels is presented in this paper. The present paper highlights the ...

Modeling and Characterization of Superconducting MEMS for Microwave Applications in Radioastronomy

N. Al Cheikh[1], P. Xavier[1], J. Duchamp[1], and K. Schuster[2]
[1]Institute of Microelectronics, Electromagnetism and Photonics (IMEP-LAHC), Grenoble, France
[2]Institute of Millimetrics Radio Astronomy (IRAM), Grenoble, France

Superconducting GHz electronics circuits are frequently used in Radio Astronomy instrumentation. The features of these instrumentations can be significantly improved by using tuneable capacitances, which can be realized by electrically actuated, micromechanical bridges (MEMS) made of superconducting Niobium (Nb). In order to analyze the electromechanical behavior of such devices and the intrinsic ...

Efficient Generation of Surface Plasmon Polaritons with Asymmetric Nano-structures

J. Chen
Peking University
China

This paper covers the following: * All-Optical Light Modulation of surface plasmon polaritons (SPPs) is achieved using asymmetric single nanoslits. A high on/off switching ratio of >20 dB and phase variation of >? were observed with the device lateral dimension of only about 2 ?m. * Efficient unidirectional excitation of SPP as well as beam splitting are achieved using the ...

Investigation on MEMS Based Thermal Sensor for Cancer Detection

A. V. Lakshmi[1], K. C. Devi[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

This paper presents the design and simulation of a thermal sensor using COMSOL Multiphysics® software for the detection of low body temperature syndrome which can allow the early detection of cancer. This sensor is made of an alloy consisting of two materials with different coefficients of thermal expansion. The main objective of this work is to investigate the structural change in the sensor ...

Magnetic Nanoparticles for Novel Granular Spintronic Devices

A. Regtmeier[1], A. Weddemann[2], I. Ennen[3], and A. Hütten[1]
[1]Dept. of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany
[2]Dept. of Elect. Eng. and Comp. Science, Lab. for Electromagnetic and Electronic Syst., MIT, Cambridge, MA
[3]Institute of Solid State Physics, Vienna University of Technology, Vienna, Austria

Superparamagnetic nanoparticles have a wide range of applications in modern electric devices. Recent developments have identi fied them as components for a new type of magnetoresistance sensor. We propose a model for the numeric evaluation of the sensor properties. Based on the solutions of the Landau-Lifshitz-Gilbert equation for a set of homogeneously magnetized spheres arranged in highly ...

Simulation of MEMS Based Pressure Sensor for Diagnosing Sleep Disorders

J. Vijitha[1], S. S. Priya[1], K. C. Devi[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

Sleep apnea is a type of sleep disorder characterized by pauses in breathing or instances of shallow or infrequent breathing during sleep. There is a need to diagnose sleep apnea since it leads to fluctuations in the oxygen level that in turn affect the heart rate and blood pressure. In order to detect this disorder, a Micro Electro Mechanical System (MEMS) based piezoelectric pressure sensor was ...

Study of Pull-In Voltage in MEMS Actuators

P. D. Hanasi[1], B. G. Sheeparamatti[1], B. B. Kirankumar[1]
[1]Basaveshwar Engineering College, Bagalkot, Karnataka, India

Micro cantilevers are the basic MEMS structures, which can be used both as sensors and actuators. The . The objective of this work is to study concept of pull-in voltage and how to reduce the same. Voltage is applied to upper cantilever beam and lower contact electrode is made as ground. By increasing common area between cantilever beam and contact electrode, and also by reducing thickness of the ...

Optimization of Smart Diaphragm Material for Pressure Sensor in Ventilators

M. Algappan[1], P. C. Chakravarthi[1], R. Keerthana[1], S. Mangayarkarasi[1], A. Kandaswamy[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

A medical ventilator is an imperative device used to save life by delivering an assortment of air and oxygen into and out of the patients’ lungs to administer breathing or to assist obligatory breathing. The commercially available diaphragm based pressure sensors made up of silicon measure the air and oxygen flow. The proposed work utilizes the Piezo electric material for the pressure range ...

MEMS Based Tactile Sensors for Robotic Surgery

V. Nivethitha[1], S. P. Rakavi[1], K. C. Devi[1]
[1]PSG College Of Technology, Coimbatore, Tamil Nadu, India

In this work, a piezoelectric tactile sensor will be designed and simulated using COMSOL Multiphysics®. The sensor is designed in order to assess the pressure exerted on the human body while the robotic surgery is performed. The sensor consists of a rigid and compliant cylindrical element. A circular PDMS (Polydimethylsiloxane) film is sandwiched between the rigid cylinder and the base plate to ...

Thermal Simulation of FCBGA Package with Heat Sink

M. R. Naik[1]
[1]Nitte Meenakshi Institute of Technology, Bengaluru, Karnataka, India

In a modern IC design, the capability of predicting the temperature profile is critically important as well as cooling and related thermal problems are the principal challenges. To address these challenges, thermal analysis must be embedded within IC synthesis. This paper presents thermal analysis of the FCBGA chip with a 4mm×4mm×0.3mm silicon die. The silicon die dissipates heat flux of ...