Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Coupled Numerical Modeling and Thermodynamic Approach for SiC Growth Process

J. M. Dedulle [1], K. Ariyawong [1], D. Chaussende [2]
[1] Univ. Grenoble Alpes, Grenoble, France
[2] CNRS, Grenoble, France

Silicon carbide (SiC) single crystals are industrially produced by the physical vapor transport technique. Apart from the geometry of the growth setup, there are two main process parameters that can be controlled: temperature and pressure. To support the development of the process, numerical simulation has imposed as the only tool able to describe the process itself, providing a good evaluation ...

Heat Transfer Simulation for Reliability Estimation of Additive Manufacturing Process using the COMSOL Multiphysics® Software

K. W. K. Leung [1], A. Keshtgar [1], N. Iyyer [1],
[1] Technical Data Analysis, Inc., Falls Church, VA, USA

Selective laser melting (SLM) is a popular additive manufacturing (AM) process that creates 3D metal parts by fusing fine metallic powder together. However, it remains difficult to certify AM part as its final quality can largely vary, depending on material and process variations. These variations govern its final density, residual stress distribution and microstructure, resulting in uncertainty ...

Electro-Thermal Analysis of a Micro Heater for Lab-on-Chip Applications

S. Kalaiselvi [1], L. Sujatha [1],
[1] Centre for MEMS and Micro Fluidics, Rajalaksmi Engineering College, Chennai,Tamil Nadu,India

The Lab -on - chip (LOC) application integrates multiple functionality on a single chip which readily manipulate and delivers the result. Micro Electro Mechanical Systems (MEMS) micro heater is widely used in heating the various Lab -on-a- chip (LOC) application, which offers great accuracy, minimum power consumption and compatible to CMOS technology. This paper discusses two different design ...

Tunnels, a New Potential Source of Energy: 3D Modeling of a Heat Exchanger within Tunnel Lining

C. Soussi [1], O. Fouché [2], G. Bracq [3], S. Minec [3],
[1] Le Cnam, Paris, France
[2] Ecole des Ponts, Champs-sur-Marne, France
[3] Bouygues Construction, Saint-Quentin-en-Yvelines, France

This work investigates the possibility of thermal activation of future tunnels to heat and/or cool the surface buildings or infrastructure such as subways stations. The principle is to insert pipes in the tunnel lining segments, which are connected to a geothermal pump. A heat transfer fluid antifreeze circulates inside the tubes to exchange heat with the surrounding environment (tunnel air and ...

Process Modeling and Optimization of Design Parameters in a Falling Film Plate and Frame Evaporator

A. Donaldson [1], A. Thimmaiah [2],
[1] Dalhousie University, Halifax, Nova Scotia, Canada
[2] National Institute of Technology Karnataka, Mangalore, Karnataka, India.

COMSOL Multiphysics® software is used to explore the impact of distributor width on the film thickness, and the resulting sensitivity of overall thermal efficiency in a plate and frame triple-effect evaporator. A stable film is crucial to maintain a minimum wetting rate, to circumvent the “dry-out condition”. The hydrodynamics of stable film development as a function of distributor width was ...

Heat Transfer Model for Embedded Thermocouple in Firefighter Glove

D. Mrugala, T. Riebeck, and W. Lang
Institute for Microsensors, -actuators and –systems (IMSAS)
University of Bremen
Bremen, Germany

The Integration of contact heat measurement with intelligent fire fighter gloves assumes parametric simulations with the heat transfer module of COMSOL. A thermocouple is embedded into high temperature protective layers of the glove and measures contact heat. This is done by by pressing the hand backside of the glove against a hot device like a door. The Heat transfer module has been used to ...

Use of Simulation in the Development of Next-generation Measurement Standards for Radiation Dosimetry

R. E. Tosh[1], H. Chen-Mayer[1]
[1]NIST, Gaithersburg, MD, USA

Calibration of field instruments used in radiation treatment clinics is currently traceable to NIST primary standards via protocols involving static, flat-field radiation beams. By contrast, radiation beams prescribed for treating cancer incorporate temporal and spatial modulation strategies in order to maximize dose to the tumor while sparing healthy tissue. Differences in the detector ...

Sensibility Analysis of Inductance Involving an E-core Magnetic Circuit for Non Homogeneous Material

K. Z. Gomes [1], T. A. G. Tolosa [1], E. V. S. Pouzada [1],
[1] Mauá Institute of Technology, São Caetano do Sul, SP, Brazil

In this work, a methodology is developed, based on the application of finite element method in the frequency domain, using the COMSOL Multiphyics software, aiming the sensibility analysis of inductance calculation involving some configurations of an E-core magnetic circuit. Such important analysis, are made from several geometries and considering different frequencies for the source current ...

Determination of the Load-dependent Thermal Conductivity of Porous Adsorbents

O. Kraft [1], J. Gaiser [1], M. Stripf [1],
[1] University of Applied Sciences, Karlsruhe, Baden-Würtemberg, Germany

Standard measuring techniques for thermal conductivity cannot be readily applied to determine the load-dependent thermal conductivity of porous adsorbents, because the local ad- and desorption inside the specimen and the thickness of the specimen are not considered. Hence, in this work a new measuring procedure combining the transient hot bridge (THB) with a three dimensional finite element ...

Simulation and Validation of Seasonal Soil Temperature Variations Using COMSOL Multiphysics® Software

L. J. Matel [1],
[1] Green Streets Infrastructure LLC, Seattle, WA, USA

The influence of the energy (heat) stored in the earth as a major factor in environmental soil processes is recognized by the soil science community. The heat (energy) supplied by the earth is known to fluctuate with depth below ground surface and time of year, obviously as a function of solar radiation variations through the seasons. The variation of energy available to drive evaporation can ...