Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Pulsed Eddy Current Probe Development to Detect Inner Layer Cracks Near Ferrous Fasteners Using COMSOL Modeling Software

V. Babbar[1], P. Whalen[1], T. Krause[1]
[1]Department of Physics, Royal Military College of Canada, Kingston, ON, Canada

Surface breaking cracks in conductive structures can be detected by conventional eddy current techniques. However, it is very difficult to detect inner layer defects in multilayered conductive structures either by conventional eddy current or ultrasonic methods. The transient/pulsed eddy current (PEC) technology can potentially overcome these limitations and is being developed for detection of ...

Poroelastic Models of Stress Diffusion and Fault Re-Activation in Underground Injection

R. Nopper[1], J. Clark[2], C. Miller[1]
[1]DuPont Company, Wilmington, DE, USA
[2]DuPont Company, Beaumont, TX, USA

Stress and failure in the earth have long been observed to couple to hydrogeology. Poroelastic models, introduced by soil scientists, can account for strong two-way coupling between porous crustal rock formations and their pore fluids. Current efforts to provide new energy resources (water injection in EGS, enhanced oil recovery) and to reduce pollution (CO2 sequestration, deepwell disposal) ...

Natural Convection Driven Melting of Phase Change Material: Comparison of Two Methods

D. Groulx[1], F. Samara[1], P.H. Biwole[2]
[1]Department of Mechanical Engineering, Dalhousie University, Halifax, NS, Canada
[2]Department of Mathematics and Interactions, University of Nice Sophia-Antipolis, Nice, France

Design of latent heat energy storage systems (LHESS) requires knowledge of heat transfer processes within them, as well as the phase change behavior of the phase change material (PCM) use. COMSOL Multiphysics can be used to model (LHESS). Natural convection plays a crucial role during the charging phase of the LHESS, and methods to incorporate this heat transfer mode within COMSOL simulation ...

Modeling Microwave Waveguide Components: The Tuned Stub

R.W. Pryor[1]
[1]Pryor Knowledge Systems, Bloomfield Hills, MI, USA

The waveguide device modeled here specifically demonstrates the exploration of a small, but very important, subset of components of the family of microwave hardware devices designed to facilitate the optimized transfer of power from the generating source to the consuming load. Each of those components is called, in electronics terminology, a Tuned Stub. A stub is a length of transmission line ...

Design Geometry Optimization of Vertical Cracks in Thermal Barrier Coatings from Simulated Thermal and Mechanical Behavior

C. Heveran[1], J. Xu[1], D. Cole[2], S. Basu[1], V. Sarin[1]
[1]Division of Materials Science and Engineering, Boston University, Brookline, MA, USA
[2]Department of Mechanical Engineering, Boston University, Brookline, MA, USA

Turbine blades are coated with thermal barrier coatings (TBCs) to reduce operating temperature. TBCs experience stress from coefficient of thermal expansion mismatch with the bond-coat and substrate. Vertical cracks are thought to offer stress relief, but influence of crack geometry on TBC thermal and mechanical properties is not well understood. A two-dimensional, steady-state model is employed ...

Steps for the Optimization of Pipe and Tubing Extrusion Dies

J.R. Puentes[1], T.A. Osswald[1], S. Schick[2], J. Berg[2]
[1]Polymer Engineering Center, University of Wisconsin, Madison, WI, USA
[2]TEEL Plastics, Baraboo, WI, USA

The extrusion of polyolefin pipes suffers degradation due to mechanical design problems of the extrusion die that is commonly used. This study uses numerical and computational approaches to detect problematic areas in the die geometry. Simulations show that in the conventional die there are areas of stagnation and recirculation of the melt flow, resulting in greater residence times, one of the ...

Modeling Internal Heating of Optoelectronic Devices Using COMSOL

N. Brunner[1][,][2]
[1]Voxtel, Inc, Beaverton, OR, USA
[2]University of Oregon, Eugene, OR, USA

In this paper the heat transfer module in COMSOL is utilized to simulate internal heating of an Avalanche Photodiode due to light-induced current through a resistivity that depends on charge carrier concentrations in the device. Initial tests are done by modeling the heating process on a previously-solved silicon p-n junction as a proof of concept before advancing to a more complicated geometry. ...

Computation of Capacitance, Inductance, and Potential Distribution of Integrated-Circuit Interconnects for Unshielded Four Conductors with Three Levels Systems

S.M. Musa[1], M.N.O. Sadiku[1], J.D. Oliver[1]
[1]Prairie View A&M University, Prairie View, TX, USA

In this paper an attempt has been made to design and analyze integrated circuit interconnects for unshielded four conductors with three levels system using Finite Element Method (FEM). The computational and simulation work has been carried out with help of COMSOL Multiphysics software. We illustrate that FEM is as accurate and effective for modeling multilayered multiconductor transmission ...

Numerical Simulation of Phonon Dispersion Relations for Phononic Crystals

G. Zhu[1], E.M. Dede[1]
[1]Toyota Research Institute of North America, Ann Arbor, MI, USA

In previous work, a two-dimensional (2D) model was carried out to simulate the phononic band structure of a phononic crystal with square lattice structure, but this model did not account for the out-of-plane phonon dispersions [1]. In fact, for 2D films used for coating materials, it is more interesting to understand their cross-plane properties. In this work, the phonon dispersion relation of ...

Conjugate Heat Transfer

J. Crompton[1], L. Gritter[1], S. Yushanov[1], K. Koppenhoefer[1]
[1]AltaSim Technologies, Columbus, OH, USA

Quenching from high temperature by fluid flow has been analyzed; when no phase transformation occurs heat transfer is a function of conduction and convection. Flow conditions may lead to turbulent flow that affects the heat dissipation over the surface. Analysis of heat transfer with phase transformation is more complex ue to the range of near-wall effects from film boiling, transition boiling, ...