Disk-Stack Heat Sink
Application ID: 3576
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to even out the temperature distribution. This exercise highlights a number of useful modeling techniques such as combining 3D solids and shells and using thin layer boundary conditions in replacing 3D thin geometries by 2D boundaries.
This application was built using the following:Heat Transfer Module
The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product\'s capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.