Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Modeling of Retinal Electrical Stimulation Using a Micro Electrode Array Coupled with the Gouy-Chapman Electrical Double Layer Model to Investigate Stimulation Efficiency

F. Dupont, R. Scapolan, C. Condemine, J.F. BĂȘche, M. Belleville, and P. Pham
CEA, LETI, Minatec, Grenoble, France

The electrical stimulation for retinal implant has known significant improvements in the last decades with many implantations and experimentations. The ability to create better controlled and adapted signals to increase the efficiency in stimulation is a major objective. The aim of this study is to develop a numerical platform based on COMSOL Multiphysics to simulate different waveforms. The ...

An Elastic and Hyperelastic Material Model of Joint Cartilage - Calculation of the Pressure Dependent Material Stress in Joint Cartilage

T. Reuter, and M. Hoffmann
fzmb GmbH
Research Centre of Medical Technology and Biotechnology
Bad Langensalza, Germany

In this paper we introduce a elastic and hyperelastic model to describe the pressure dependent material stress in joint cartilage. We used the pressure dependent E-modulus E = f(s) to calculate the material stress. E = f(s) is a degree 4 polynomial . The indentor was pressed 0.4 mm into the tissue. The results show that the maximal stress at the contact zone between indentor and cartilage account ...

Advanced Application of an Automated Generative Tool for MEMS Based on COMSOL Multiphysics

F. Bolognini
University of Cambridge
Cambridge, UK

This work presents a different use of COMSOL as an integrated component of a computational tool framework used to automate designs creation. CNS-Burst is a computational synthesis method that has been implemented with the aim of automatically generating solutions to an assigned design task. COMSOL is integrated in the method and used to evaluate the performance of the design solutions found. ...

Microwave Plasma Simulation Applied to a Double ICP Jet Reactor

H.-E. Porteanu, and R. Gesche
Berlin, Germany

ICP reactors are usually meter sized and driven at RF frequencies, for example at 13.56 MHz. We developed a miniature resonator allowing an inductive type of coupling of microwaves at 2.45 GHz to a plasma jet, flowing in ceramic tubes. Previous experiments and simulations show an efficient energy transfer of microwaves to plasma of about 80 %. The new development of our ICP structure contains ...

An Improved Model for High Temperature Inductive Heating

S. A. Halvorsen, and N. Kleinknecht
Teknova AS
Kristiansand, Norway

An axially symmetric multiphysics model for industrial induction furnaces has successfully been converted from COMSOL Multiphysics version 3.5a to version 4.2. The model combines computation of magnetic fields, heat transfer and thermal stresses. The inner part of the furnace is described by a few discrete state variables. While the current in the induction coil is input in COMSOL, the model ...

Impulsive Thermomechanics of hypersonic surface phononic crystals

F. Banfi[1], D. Nardi[2], and M. Travagliati[3]
[1]Dipartimento Matematica e Fisica, UniversitĂ  Cattolica, Brescia, Italy
[2]JILA, University of Colorado at Boulder, Boulder, Colorado, United States
[3]Center for Nanotechnology Innovation @NEST, Istituto Italiano di Tecnologia, Pisa, Italy

Ultrafast optical generation of pseudosurface acoustic waves is investigated in hypersonic surface phononic crystals. The thermomechanics is modeled from first-principles to follow the initial impulsive heat-driven displacement in the time domain. Spectral decomposition of the displacement over the surface phononic crystal eigenmodes outlines asymmetric resonances featuring the coupling between ...

La5Ca9Cu24O41 Layers as 1D Heat Spreaders for Thermal Management Solutions

C. Orfanidou, and J. Giapintzakis
Department of Mechanical and Manufacturing Engineering
University of Cyprus
Nicosia, Cyprus

This paper deals with the design of a viable thermal management solution using La5Ca9Cu24O41 layers for heat channeling. The simulations are carried out with the finite element method using COMSOL Multiphysics Heat Transfer Module. COMSOL 4.2 was used to model and optimize silicon devices. Malfunctioning elements on silicon devices are sometimes converted into hotspots resulting in the ...

Modeling of the Heat Transfer Between a CO2 Sequestration Well and the Surrounding Geological Formation

B. Sponagle[1], M. Amadu[2], D. Groulx[1], and M. Pegg[2]
[1]Mechanical Engineering, Dalhousie University, Halifax, NS, Canada
[2]Process Engineering and Applied Science, Dalhousie University, Halifax, NS, Canada

In a carbon sequestration system CO2 would be pumped down a well and into a reservoir at supercritical temperatures and pressures. An important consideration is the long term stability of the reservoir. The goal of these simulations is to thermally model the injection well and investigate the temperature gradient developed in the cap rock. Ultimately, results from this study will lead to an ...

Shape Optimization of Electric and Magnetic System using Level Set Technique and Sensitivity Analysis

Y. Sun Kim, A. Weddemann, J. Jadidian, S. Khushrushahi, and M. Zahn
Dept. of Electrical Engineering and Computer Science
Cambridge, MA

The classical optimization method has been applied to many design problems for electromagnetic systems. One of its major difficulties is related to meshing problems arising from shape modifications. In order to circumvent these kinds of technical difficulties with moving mesh problems, several researches have tried to formulate shape optimization with fixed mesh analyses based on fixed grid ...

Optimization of a High-Temperature High-Pressure Direct Wafer Bonding Process for III-V Semiconductors

R. Martin, J. Kozak, K. Anglin, and W. Goodhue
University of Massachusetts Lowell
Lowell, MA

Many optoelectronic devices utilize a heterojunction of a pair semiconducting materials including high-efficiency MEMS devices, solar cells, LEDs, and VCSELs. One fabrication technique which achieves such a device is direct wafer fusion. To optimize the process, COMSOL Multiphysics 4.0 was used to test various geometric configurations of the fixture. 2D and 3D models were created in order ...

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